Top1000 Scholar

Scholarly Index

Tung‐Han Chuang

National Taiwan University; 3,659 total citations; 237 total publications; best world rank #29

National Taiwan University

3,659Total citations
237Total publications
32H-index

Published ranking records

FieldWindowWorld rankNational rankImpact score
Electronic Packaging and Soldering TechnologiesLifetime125TW 1398.30
3D IC and TSV technologiesLifetime136TW 1498.33
Advanced Welding Techniques AnalysisLifetime285TW 797.34
Intermetallics and Advanced Alloy PropertiesLifetime546TW 1097.15
Copper Interconnects and ReliabilityLifetime482TW 3395.70
Metallurgical and Alloy ProcessesLifetime256TW 795.42
Copper Interconnects and Reliability2021-202529TW 893.47
Electronic Packaging and Soldering Technologies2021-2025248TW 2089.18
3D IC and TSV technologies2021-2025354TW 3685.33
Surface and Thin Film Phenomena2021-2025648TW 446.00