Top1000 Scholar

Scholarly Index

Cheng–En Ho

Yuan Ze University; 3,560 total citations; 136 total publications; best world rank #78

Yuan Ze University

3,560Total citations
136Total publications
30H-index

Published ranking records

FieldWindowWorld rankNational rankImpact score
3D IC and TSV technologiesLifetime124TW 1398.41
Electronic Packaging and Soldering TechnologiesLifetime143TW 1498.20
Copper Interconnects and ReliabilityLifetime286TW 1796.97
Intermetallics and Advanced Alloy PropertiesLifetime652TW 1396.72
Advanced Welding Techniques AnalysisLifetime575TW 1395.72
Electrodeposition and Electroless CoatingsLifetime382TW 1294.66
Metallurgical and Alloy ProcessesLifetime511TW 1492.47
Copper Interconnects and Reliability2021-202578TW 1888.25
Electronic Packaging and Soldering Technologies2021-2025251TW 2189.09
3D IC and TSV technologies2021-2025450TW 4382.56
Electrodeposition and Electroless Coatings2021-2025321TW 1276.43
Metallurgical and Alloy Processes2021-2025333TW 548.46