Scholarly Index

Yongjun Huo

Beijing Institute of Technology; 536 total citations; 61 total publications; best world rank #174

Beijing Institute of Technology

536Total citations
61Total publications
14H-index

Published ranking records

FieldWindowWorld rankNational rankImpact score
Electronic Packaging and Soldering Technologies2021-2025174CN 9991.95
Copper Interconnects and Reliability2021-2025265CN 6473.19
3D IC and TSV technologies2021-2025987CN 36368.41