Top1000 Scholar

Scholarly Index

Junichi Koike

Tohoku University; 10,008 total citations; 323 total publications; best world rank #74

Tohoku University

10,008Total citations
323Total publications
45H-index

Published ranking records

FieldWindowWorld rankNational rankImpact score
Copper Interconnects and ReliabilityLifetime74JP 598.76
Aluminum Alloys Composites PropertiesLifetime334JP 2598.85
Magnesium Alloys: Properties and ApplicationsLifetime169JP 1798.28
Electronic Packaging and Soldering TechnologiesLifetime221JP 1497.62
Advanced Welding Techniques AnalysisLifetime408JP 3296.70
Phase-change materials and chalcogenidesLifetime428JP 5095.75
Electrodeposition and Electroless CoatingsLifetime640JP 4792.19
Copper Interconnects and Reliability2021-202593JP 686.66
Electronic Packaging and Soldering Technologies2021-2025820JP 4474.27