Scholarly Index
Steffen Wiese
Fraunhofer Institute for Reliability and Microintegration; 2,048 total citations; 183 total publications; best world rank #150
Fraunhofer Institute for Reliability and Microintegration
2,048Total citations
183Total publications
22H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| Electronic Packaging and Soldering Technologies | Lifetime | 323 | DE 12 | 96.89 |
| 3D IC and TSV technologies | Lifetime | 355 | DE 13 | 96.73 |
| Electronic Packaging and Soldering Technologies | 2021-2025 | 521 | DE 13 | 81.59 |
| 3D IC and TSV technologies | 2021-2025 | 522 | DE 8 | 80.30 |
| Electrical and Thermal Properties of Materials | 2021-2025 | 150 | DE 8 | 63.88 |