Scholarly Index
Chih‐Ming Chen
National Chung Hsing University; 5,563 total citations; 297 total publications; best world rank #11
National Chung Hsing University
5,563Total citations
297Total publications
37H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| 3D IC and TSV technologies | Lifetime | 96 | TW 9 | 98.69 |
| Electronic Packaging and Soldering Technologies | Lifetime | 98 | TW 10 | 98.65 |
| Copper Interconnects and Reliability | Lifetime | 169 | TW 11 | 97.94 |
| Metallurgical and Alloy Processes | Lifetime | 214 | TW 5 | 95.92 |
| Intermetallics and Advanced Alloy Properties | Lifetime | 683 | TW 14 | 96.59 |
| Electrodeposition and Electroless Coatings | Lifetime | 270 | TW 8 | 95.83 |
| Electronic Packaging and Soldering Technologies | 2021-2025 | 22 | TW 5 | 97.85 |
| Copper Interconnects and Reliability | 2021-2025 | 11 | TW 5 | 96.78 |
| 3D IC and TSV technologies | 2021-2025 | 63 | TW 10 | 95.65 |
| Electrodeposition and Electroless Coatings | 2021-2025 | 52 | TW 4 | 93.45 |
| Semiconductor materials and interfaces | 2021-2025 | 349 | TW 1 | 86.64 |
| Metallurgical and Alloy Processes | 2021-2025 | 102 | TW 2 | 74.99 |
| Enterobacteriaceae and Cronobacter Research | 2021-2025 | 301 | TW 7 | 62.73 |