Top1000 Scholar

Scholarly Index

C. R. Kao

National Taiwan University; 7,468 total citations; 303 total publications; best world rank #18

National Taiwan University

7,468Total citations
303Total publications
51H-index

Published ranking records

FieldWindowWorld rankNational rankImpact score
3D IC and TSV technologiesLifetime19TW 399.54
Electronic Packaging and Soldering TechnologiesLifetime18TW 199.47
Intermetallics and Advanced Alloy PropertiesLifetime132TW 298.95
Advanced Welding Techniques AnalysisLifetime100TW 198.77
Copper Interconnects and ReliabilityLifetime118TW 598.33
Metallurgical and Alloy ProcessesLifetime181TW 396.30
3D IC and TSV technologies2021-202566TW 1195.53
Electronic Packaging and Soldering Technologies2021-202573TW 1095.92
Semiconductor materials and interfaces2021-2025663TW 478.66
Copper Interconnects and Reliability2021-2025271TW 4072.89
Electrodeposition and Electroless Coatings2021-2025378TW 1373.53
Metallurgical and Alloy Processes2021-2025132TW 370.00