Top1000 Scholar

Scholarly Index

Abhijit Dasgupta

University of Maryland, College Park; 5,026 total citations; 341 total publications; best world rank #91

University of Maryland, College Park

5,026Total citations
341Total publications
38H-index

Published ranking records

FieldWindowWorld rankNational rankImpact score
Electronic Packaging and Soldering TechnologiesLifetime91US 2698.72
3D IC and TSV technologiesLifetime175US 5997.98
Integrated Circuits and Semiconductor Failure AnalysisLifetime960US 35596.33
Advanced Welding Techniques AnalysisLifetime572US 6895.75
Electrostatic Discharge in ElectronicsLifetime411US 12294.96
Metal Forming Simulation TechniquesLifetime824US 14295.36
Material Properties and ProcessingLifetime784US 18788.48
Engineering and Materials Science StudiesLifetime891US 7471.78
Electronic Packaging and Soldering Technologies2021-2025246US 1789.35
3D IC and TSV technologies2021-2025774US 12173.88