Scholarly Index
D. Edelstein
IBM (United States); 3,576 total citations; 132 total publications; best world rank #268
IBM (United States)
3,576Total citations
132Total publications
27H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| 3D IC and TSV technologies | Lifetime | 268 | US 78 | 97.35 |
| Copper Interconnects and Reliability | Lifetime | 293 | US 121 | 96.93 |
| Electronic Packaging and Soldering Technologies | Lifetime | 394 | US 74 | 96.43 |
| Copper Interconnects and Reliability | 2021-2025 | 274 | US 39 | 72.76 |