Top1000 Scholar

Scholarly Index

Eric Chason

John Brown University; 10,870 total citations; 240 total publications; best world rank #43

John Brown University

10,870Total citations
240Total publications
50H-index

Published ranking records

FieldWindowWorld rankNational rankImpact score
Copper Interconnects and ReliabilityLifetime43US 2599.13
Metal and Thin Film MechanicsLifetime256US 8199.18
Integrated Circuits and Semiconductor Failure AnalysisLifetime152US 7698.89
Electronic Packaging and Soldering TechnologiesLifetime74US 2198.82
Ion-surface interactions and analysisLifetime143US 6698.90
Semiconductor materials and devicesLifetime758US 32898.67
Diamond and Carbon-based Materials ResearchLifetime921US 21096.88
3D IC and TSV technologiesLifetime671US 16994.82
Copper Interconnects and Reliability2021-2025144US 2381.35