Scholarly Index
Mario González
IMEC; 3,122 total citations; 207 total publications; best world rank #218
IMEC
3,122Total citations
207Total publications
27H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| 3D IC and TSV technologies | Lifetime | 360 | BE 14 | 96.70 |
| Electronic Packaging and Soldering Technologies | Lifetime | 376 | BE 5 | 96.57 |
| 3D IC and TSV technologies | 2021-2025 | 218 | BE 10 | 89.89 |
| Electronic Packaging and Soldering Technologies | 2021-2025 | 597 | BE 11 | 79.71 |
| Copper Interconnects and Reliability | 2021-2025 | 960 | BE 70 | 42.85 |