Scholarly Index
Seung‐Boo Jung
Sungkyunkwan University; 11,147 total citations; 493 total publications; best world rank #16
Sungkyunkwan University
11,147Total citations
493Total publications
51H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| 3D IC and TSV technologies | Lifetime | 16 | KR 1 | 99.57 |
| Electronic Packaging and Soldering Technologies | Lifetime | 17 | KR 1 | 99.50 |
| Advanced Welding Techniques Analysis | Lifetime | 28 | KR 1 | 99.52 |
| Intermetallics and Advanced Alloy Properties | Lifetime | 166 | KR 6 | 98.72 |
| Aluminum Alloys Composites Properties | Lifetime | 495 | KR 16 | 98.51 |
| Nanomaterials and Printing Technologies | Lifetime | 99 | KR 11 | 96.97 |
| Aluminum Alloy Microstructure Properties | Lifetime | 516 | KR 13 | 97.84 |
| Copper Interconnects and Reliability | Lifetime | 442 | KR 18 | 95.94 |
| Welding Techniques and Residual Stresses | Lifetime | 664 | KR 12 | 96.32 |
| Metallurgical and Alloy Processes | Lifetime | 252 | KR 5 | 95.46 |
| Electrodeposition and Electroless Coatings | Lifetime | 632 | KR 12 | 92.26 |
| 3D IC and TSV technologies | 2021-2025 | 58 | KR 5 | 95.89 |
| Electronic Packaging and Soldering Technologies | 2021-2025 | 80 | KR 6 | 95.58 |