Scholarly Index
Herman Oprins
IMEC; 2,189 total citations; 151 total publications; best world rank #106
IMEC
2,189Total citations
151Total publications
23H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| 3D IC and TSV technologies | Lifetime | 336 | BE 13 | 96.83 |
| Electronic Packaging and Soldering Technologies | Lifetime | 503 | BE 8 | 95.78 |
| 3D IC and TSV technologies | 2021-2025 | 106 | BE 4 | 94.06 |
| Copper Interconnects and Reliability | 2021-2025 | 191 | BE 25 | 77.59 |
| Electromagnetic Compatibility and Noise Suppression | 2021-2025 | 869 | BE 11 | 69.14 |