Scholarly Index
Tao Hang
Shanghai Jiao Tong University; 4,034 total citations; 183 total publications; best world rank #8
Shanghai Jiao Tong University
4,034Total citations
183Total publications
32H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| Electronic Packaging and Soldering Technologies | Lifetime | 553 | CN 156 | 95.48 |
| 3D IC and TSV technologies | Lifetime | 572 | CN 140 | 95.31 |
| Electrodeposition and Electroless Coatings | Lifetime | 338 | CN 40 | 95.03 |
| Copper Interconnects and Reliability | Lifetime | 718 | CN 43 | 94.39 |
| Nanomaterials and Printing Technologies | Lifetime | 420 | CN 102 | 92.63 |
| Copper Interconnects and Reliability | 2021-2025 | 8 | CN 1 | 97.06 |
| Electrodeposition and Electroless Coatings | 2021-2025 | 40 | CN 25 | 94.33 |
| Electronic Packaging and Soldering Technologies | 2021-2025 | 146 | CN 84 | 93.00 |
| 3D IC and TSV technologies | 2021-2025 | 157 | CN 76 | 92.43 |
| Nanoporous metals and alloys | 2021-2025 | 593 | CN 306 | 36.03 |