Scholarly Index
Jochen M. Schneider
TUM Klinikum; 16,410 total citations; 621 total publications; best world rank #69
TUM Klinikum
16,410Total citations
621Total publications
63H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| Metal and Thin Film Mechanics | Lifetime | 69 | DE 7 | 99.67 |
| Semiconductor materials and devices | Lifetime | 301 | DE 24 | 99.29 |
| Diamond and Carbon-based Materials Research | Lifetime | 185 | DE 16 | 98.96 |
| MXene and MAX Phase Materials | Lifetime | 158 | DE 11 | 99.12 |
| Boron and Carbon Nanomaterials Research | Lifetime | 102 | DE 10 | 98.95 |
| Advanced ceramic materials synthesis | Lifetime | 313 | DE 25 | 98.56 |
| Intermetallics and Advanced Alloy Properties | Lifetime | 237 | DE 23 | 98.35 |
| Copper Interconnects and Reliability | Lifetime | 184 | DE 15 | 97.78 |
| Advanced materials and composites | Lifetime | 530 | DE 36 | 98.13 |
| Advanced Materials Characterization Techniques | Lifetime | 479 | DE 60 | 95.35 |
| High-Temperature Coating Behaviors | Lifetime | 883 | DE 65 | 95.32 |
| Vacuum and Plasma Arcs | Lifetime | 336 | DE 39 | 93.18 |
| Metal and Thin Film Mechanics | 2021-2025 | 90 | DE 2 | 97.90 |
| Advanced Materials Characterization Techniques | 2021-2025 | 188 | DE 25 | 83.37 |
| Ion-surface interactions and analysis | 2021-2025 | 410 | DE 34 | 80.12 |
| Copper Interconnects and Reliability | 2021-2025 | 356 | DE 18 | 67.85 |