Scholarly Index
Kuan‐Neng Chen
National Yang Ming Chiao Tung University; 5,691 total citations; 302 total publications; best world rank #7
National Yang Ming Chiao Tung University
5,691Total citations
302Total publications
40H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| 3D IC and TSV technologies | Lifetime | 49 | TW 6 | 99.22 |
| Electronic Packaging and Soldering Technologies | Lifetime | 51 | TW 6 | 99.03 |
| Copper Interconnects and Reliability | Lifetime | 100 | TW 2 | 98.47 |
| Additive Manufacturing and 3D Printing Technologies | Lifetime | 369 | TW 2 | 98.09 |
| Nanofabrication and Lithography Techniques | Lifetime | 907 | TW 19 | 92.00 |
| 3D IC and TSV technologies | 2021-2025 | 11 | TW 2 | 98.74 |
| Electronic Packaging and Soldering Technologies | 2021-2025 | 15 | TW 3 | 98.30 |
| Copper Interconnects and Reliability | 2021-2025 | 7 | TW 4 | 97.09 |
| Nanofabrication and Lithography Techniques | 2021-2025 | 148 | TW 2 | 80.08 |
| Synthesis and properties of polymers | 2021-2025 | 754 | TW 14 | 77.15 |