Scholarly Index
T. Shimatsu
Tohoku University; 3,375 total citations; 337 total publications; best world rank #431
Tohoku University
3,375Total citations
337Total publications
28H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| Magnetic Properties and Applications | Lifetime | 683 | JP 92 | 97.16 |
| 3D IC and TSV technologies | Lifetime | 431 | JP 22 | 96.16 |
| Copper Interconnects and Reliability | Lifetime | 699 | JP 71 | 94.48 |
| Electronic Packaging and Soldering Technologies | Lifetime | 704 | JP 54 | 94.64 |
| Nanoporous metals and alloys | Lifetime | 731 | JP 66 | 79.49 |
| 3D IC and TSV technologies | 2021-2025 | 893 | JP 51 | 70.61 |