Scholarly Index
Chuantong Chen
The University of Osaka; 4,459 total citations; 279 total publications; best world rank #2
The University of Osaka
4,459Total citations
279Total publications
39H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| Electronic Packaging and Soldering Technologies | Lifetime | 86 | JP 7 | 98.74 |
| 3D IC and TSV technologies | Lifetime | 97 | JP 7 | 98.69 |
| Aluminum Alloys Composites Properties | Lifetime | 648 | JP 42 | 98.11 |
| Copper Interconnects and Reliability | Lifetime | 568 | JP 56 | 95.20 |
| Advanced Welding Techniques Analysis | Lifetime | 997 | JP 80 | 93.31 |
| Nanomaterials and Printing Technologies | Lifetime | 709 | JP 33 | 89.65 |
| Powder Metallurgy Techniques and Materials | Lifetime | 802 | JP 69 | 86.35 |
| Electronic Packaging and Soldering Technologies | 2021-2025 | 2 | JP 1 | 99.30 |
| 3D IC and TSV technologies | 2021-2025 | 13 | JP 2 | 98.41 |
| Aluminum Alloys Composites Properties | 2021-2025 | 140 | JP 2 | 98.32 |
| Copper Interconnects and Reliability | 2021-2025 | 39 | JP 2 | 92.53 |
| Advanced ceramic materials synthesis | 2021-2025 | 445 | JP 5 | 93.21 |
| Advanced Welding Techniques Analysis | 2021-2025 | 479 | JP 9 | 89.46 |
| Powder Metallurgy Techniques and Materials | 2021-2025 | 282 | JP 9 | 59.87 |
| Nanoporous metals and alloys | 2021-2025 | 582 | JP 24 | 36.86 |