Top1000 Scholar

Scholarly Index

Jiayun Feng

Harbin Institute of Technology; 1,614 total citations; 73 total publications; best world rank #130

Harbin Institute of Technology

1,614Total citations
73Total publications
22H-index

Published ranking records

FieldWindowWorld rankNational rankImpact score
Electronic Packaging and Soldering TechnologiesLifetime765CN 20394.41
3D IC and TSV technologiesLifetime971CN 22693.16
Electronic Packaging and Soldering Technologies2021-2025130CN 7493.47
3D IC and TSV technologies2021-2025146CN 6992.82
Nanomaterials and Printing Technologies2021-2025165CN 6986.29
Copper Interconnects and Reliability2021-2025192CN 5177.58