Scholarly Index
Jingdong Guo
Chinese Academy of Sciences; 2,881 total citations; 143 total publications; best world rank #16
Chinese Academy of Sciences
2,881Total citations
143Total publications
32H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| Electromagnetic Effects on Materials | Lifetime | 16 | CN 5 | 97.77 |
| Electronic Packaging and Soldering Technologies | Lifetime | 337 | CN 100 | 96.83 |
| Copper Interconnects and Reliability | Lifetime | 796 | CN 46 | 94.06 |
| Electronic Packaging and Soldering Technologies | 2021-2025 | 702 | CN 307 | 77.16 |
| Electromagnetic Effects on Materials | 2021-2025 | 167 | CN 122 | 65.29 |