Scholarly Index
Xingchao Mao
City University of Hong Kong; 66 total citations; 22 total publications; best world rank #427
City University of Hong Kong
66Total citations
22Total publications
6H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| Electronic Packaging and Soldering Technologies | 2021-2025 | 427 | CN 206 | 84.47 |
| 3D IC and TSV technologies | 2021-2025 | 495 | CN 192 | 81.37 |