Scholarly Index
Fu Guo
Tsinghua University; 2,454 total citations; 185 total publications; best world rank #171
Tsinghua University
2,454Total citations
185Total publications
28H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| Electronic Packaging and Soldering Technologies | Lifetime | 172 | CN 47 | 97.96 |
| 3D IC and TSV technologies | Lifetime | 171 | CN 40 | 98.01 |
| Advanced Welding Techniques Analysis | Lifetime | 700 | CN 234 | 94.99 |
| Metallurgical and Alloy Processes | Lifetime | 591 | CN 60 | 91.54 |
| Electronic Packaging and Soldering Technologies | 2021-2025 | 189 | CN 103 | 91.36 |
| 3D IC and TSV technologies | 2021-2025 | 327 | CN 139 | 86.13 |