Scholarly Index
Chukwudi Okoro
Corning (United States); 1,428 total citations; 80 total publications; best world rank #49
Corning (United States)
1,428Total citations
80Total publications
21H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| 3D IC and TSV technologies | Lifetime | 333 | US 99 | 96.84 |
| Electronic Packaging and Soldering Technologies | Lifetime | 416 | US 79 | 96.30 |
| 3D IC and TSV technologies | 2021-2025 | 49 | US 8 | 96.44 |
| Electronic Packaging and Soldering Technologies | 2021-2025 | 78 | US 7 | 95.60 |
| Copper Interconnects and Reliability | 2021-2025 | 152 | US 24 | 80.51 |