Scholarly Index
Lei Sun
Changzhou University; 2,452 total citations; 86 total publications; best world rank #57
Changzhou University
2,452Total citations
86Total publications
26H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| 3D IC and TSV technologies | Lifetime | 240 | CN 62 | 97.52 |
| Electronic Packaging and Soldering Technologies | Lifetime | 267 | CN 77 | 97.31 |
| Electronic Packaging and Soldering Technologies | 2021-2025 | 57 | CN 28 | 96.53 |
| 3D IC and TSV technologies | 2021-2025 | 123 | CN 54 | 93.51 |