Top1000 Scholar

Scholarly Index

K. N. Tu

City University of Hong Kong; 16,251 total citations; 203 total publications; best world rank #7

City University of Hong Kong

16,251Total citations
203Total publications
61H-index

Published ranking records

FieldWindowWorld rankNational rankImpact score
Electronic Packaging and Soldering TechnologiesLifetime7CN 299.70
3D IC and TSV technologiesLifetime10CN 399.72
Copper Interconnects and ReliabilityLifetime14CN 399.55
Semiconductor materials and interfacesLifetime49CN 599.50
Intermetallics and Advanced Alloy PropertiesLifetime81CN 1899.21
Silicon and Solar Cell TechnologiesLifetime130CN 598.84
Metallurgical and Alloy ProcessesLifetime388CN 3193.79
3D IC and TSV technologies2021-2025320CN 13586.29
Electronic Packaging and Soldering Technologies2021-2025394CN 19085.15
Copper Interconnects and Reliability2021-2025176CN 4478.73