Scholarly Index
Avram Bar‐Cohen
Intel (United States); 8,418 total citations; 408 total publications; best world rank #27
Intel (United States)
8,418Total citations
408Total publications
51H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| Heat Transfer and Boiling Studies | Lifetime | 32 | US 14 | 99.47 |
| 3D IC and TSV technologies | Lifetime | 43 | US 17 | 99.28 |
| Electronic Packaging and Soldering Technologies | Lifetime | 53 | US 14 | 99.02 |
| Heat Transfer and Optimization | Lifetime | 73 | US 15 | 99.54 |
| Thermal properties of materials | Lifetime | 97 | US 39 | 98.53 |
| Fluid Dynamics and Thin Films | Lifetime | 90 | US 36 | 97.99 |
| Refrigeration and Air Conditioning Technologies | Lifetime | 175 | US 22 | 98.19 |
| Spacecraft and Cryogenic Technologies | Lifetime | 344 | US 114 | 96.84 |
| Silicon Carbide Semiconductor Technologies | Lifetime | 433 | US 121 | 97.81 |
| Advanced Thermoelectric Materials and Devices | Lifetime | 322 | US 69 | 97.01 |
| Thermal Radiation and Cooling Technologies | Lifetime | 821 | US 193 | 92.69 |
| Heat Transfer and Numerical Methods | Lifetime | 27 | US 15 | 81.99 |