Scholarly Index
Ming Li
Chinese Academy of Sciences; 5,942 total citations; 387 total publications; best world rank #42
Chinese Academy of Sciences
5,942Total citations
387Total publications
40H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| Electronic Packaging and Soldering Technologies | Lifetime | 199 | CN 57 | 97.78 |
| 3D IC and TSV technologies | Lifetime | 204 | CN 53 | 97.75 |
| Copper Interconnects and Reliability | Lifetime | 558 | CN 32 | 95.26 |
| Copper Interconnects and Reliability | 2021-2025 | 42 | CN 11 | 92.21 |
| 3D IC and TSV technologies | 2021-2025 | 197 | CN 98 | 90.90 |
| Electronic Packaging and Soldering Technologies | 2021-2025 | 227 | CN 118 | 90.23 |
| Electrodeposition and Electroless Coatings | 2021-2025 | 629 | CN 281 | 63.38 |