Scholarly Index

Albert T. Wu

National Central University; 1,590 total citations; 108 total publications; best world rank #326

National Central University

1,590Total citations
108Total publications
23H-index

Published ranking records

FieldWindowWorld rankNational rankImpact score
Electronic Packaging and Soldering TechnologiesLifetime326TW 3196.87
3D IC and TSV technologiesLifetime395TW 3196.39
Copper Interconnects and ReliabilityLifetime675TW 4594.58
Electronic Packaging and Soldering Technologies2021-2025545TW 4980.84
3D IC and TSV technologies2021-2025773TW 7773.91