Scholarly Index
Albert T. Wu
National Central University; 1,590 total citations; 108 total publications; best world rank #326
National Central University
1,590Total citations
108Total publications
23H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| Electronic Packaging and Soldering Technologies | Lifetime | 326 | TW 31 | 96.87 |
| 3D IC and TSV technologies | Lifetime | 395 | TW 31 | 96.39 |
| Copper Interconnects and Reliability | Lifetime | 675 | TW 45 | 94.58 |
| Electronic Packaging and Soldering Technologies | 2021-2025 | 545 | TW 49 | 80.84 |
| 3D IC and TSV technologies | 2021-2025 | 773 | TW 77 | 73.91 |