Scholarly Index

K. N. Tu

City University of Hong Kong; 22,524 total citations; 575 total publications; best world rank #1

City University of Hong Kong

22,524Total citations

575Total publications

80H-index

Published ranking records

Field	Window	World rank	National rank	Impact score
3D IC and TSV technologies	Lifetime	1	CN 1	99.89
Electronic Packaging and Soldering Technologies	Lifetime	2	CN 1	99.88
Copper Interconnects and Reliability	Lifetime	4	CN 1	99.82
Intermetallics and Advanced Alloy Properties	Lifetime	5	CN 2	99.81
Semiconductor materials and interfaces	Lifetime	14	CN 2	99.80
Silicon and Solar Cell Technologies	Lifetime	44	CN 3	99.48
Semiconductor materials and devices	Lifetime	262	CN 16	99.36
Surface and Thin Film Phenomena	Lifetime	83	CN 2	99.15
Silicon Nanostructures and Photoluminescence	Lifetime	132	CN 8	98.68
Integrated Circuits and Semiconductor Failure Analysis	Lifetime	348	CN 18	98.12
nanoparticles nucleation surface interactions	Lifetime	197	CN 14	98.29
Metallurgical and Alloy Processes	Lifetime	249	CN 18	95.47
Microstructure and mechanical properties	Lifetime	803	CN 152	96.82
Electrodeposition and Electroless Coatings	Lifetime	311	CN 35	95.36
Chemical and Physical Properties of Materials	Lifetime	294	CN 19	87.94
Copper Interconnects and Reliability	2021-2025	17	CN 4	95.55
Electronic Packaging and Soldering Technologies	2021-2025	61	CN 32	96.31
3D IC and TSV technologies	2021-2025	77	CN 33	95.10