Scholarly Index
Xiangkun Yin
Xidian University; 731 total citations; 66 total publications; best world rank #35
Xidian University
731Total citations
66Total publications
16H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| 3D IC and TSV technologies | Lifetime | 704 | CN 171 | 94.61 |
| 3D IC and TSV technologies | 2021-2025 | 35 | CN 17 | 96.98 |
| Radio Frequency Integrated Circuit Design | 2021-2025 | 477 | CN 207 | 88.83 |
| Electromagnetic Compatibility and Noise Suppression | 2021-2025 | 256 | CN 109 | 87.51 |
| Electronic Packaging and Soldering Technologies | 2021-2025 | 288 | CN 143 | 87.72 |
| Semiconductor materials and interfaces | 2021-2025 | 425 | CN 98 | 84.94 |