Top1000 Scholar

Scholarly Index

Karel Dušek

Czech Technical University in Prague; 1,054 total citations; 153 total publications; best world rank #37

Czech Technical University in Prague

1,054Total citations
153Total publications
17H-index

Published ranking records

FieldWindowWorld rankNational rankImpact score
Electronic Packaging and Soldering TechnologiesLifetime515CZ 295.69
3D IC and TSV technologiesLifetime811CZ 193.98
Advancements in Materials EngineeringLifetime199CZ 292.24
Mechanical and Thermal Properties AnalysisLifetime591CZ 2987.55
Metallurgical and Alloy ProcessesLifetime874CZ 1588.63
Engineering and Materials Science StudiesLifetime764CZ 975.08
Electronic Packaging and Soldering Technologies2021-202537CZ 197.11
3D IC and TSV technologies2021-202567CZ 195.50
Intermetallics and Advanced Alloy Properties2021-2025906CZ 580.89
Copper Interconnects and Reliability2021-2025242CZ 174.99
Metallurgical and Alloy Processes2021-2025297CZ 652.36