Scholarly Index

Chang‐Chun Lee

National Tsing Hua University; 3,057 total citations; 265 total publications; best world rank #15

National Tsing Hua University

3,057Total citations
265Total publications
27H-index

Published ranking records

FieldWindowWorld rankNational rankImpact score
3D IC and TSV technologiesLifetime221TW 2197.66
Electronic Packaging and Soldering TechnologiesLifetime226TW 2397.61
Copper Interconnects and ReliabilityLifetime671TW 4494.61
3D IC and TSV technologies2021-202515TW 498.30
Electronic Packaging and Soldering Technologies2021-202530TW 697.52
Copper Interconnects and Reliability2021-202585TW 2087.43
Advanced Surface Polishing Techniques2021-2025837TW 387.83
Integrated Circuits and Semiconductor Failure Analysis2021-2025753TW 1380.24
Block Copolymer Self-Assembly2021-2025544TW 1751.89