Scholarly Index
Chang‐Chun Lee
National Tsing Hua University; 3,057 total citations; 265 total publications; best world rank #15
National Tsing Hua University
3,057Total citations
265Total publications
27H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| 3D IC and TSV technologies | Lifetime | 221 | TW 21 | 97.66 |
| Electronic Packaging and Soldering Technologies | Lifetime | 226 | TW 23 | 97.61 |
| Copper Interconnects and Reliability | Lifetime | 671 | TW 44 | 94.61 |
| 3D IC and TSV technologies | 2021-2025 | 15 | TW 4 | 98.30 |
| Electronic Packaging and Soldering Technologies | 2021-2025 | 30 | TW 6 | 97.52 |
| Copper Interconnects and Reliability | 2021-2025 | 85 | TW 20 | 87.43 |
| Advanced Surface Polishing Techniques | 2021-2025 | 837 | TW 3 | 87.83 |
| Integrated Circuits and Semiconductor Failure Analysis | 2021-2025 | 753 | TW 13 | 80.24 |
| Block Copolymer Self-Assembly | 2021-2025 | 544 | TW 17 | 51.89 |