Scholarly Index
Ingrid De Wolf
IMEC; 9,762 total citations; 571 total publications; best world rank #58
IMEC
9,762Total citations
571Total publications
46H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| Integrated Circuits and Semiconductor Failure Analysis | Lifetime | 107 | BE 8 | 99.08 |
| 3D IC and TSV technologies | Lifetime | 58 | BE 4 | 99.09 |
| Advanced MEMS and NEMS Technologies | Lifetime | 90 | BE 2 | 98.81 |
| Electronic Packaging and Soldering Technologies | Lifetime | 110 | BE 2 | 98.46 |
| Advanced Surface Polishing Techniques | Lifetime | 324 | BE 4 | 98.18 |
| Semiconductor materials and devices | Lifetime | 990 | BE 31 | 98.39 |
| Thin-Film Transistor Technologies | Lifetime | 501 | BE 7 | 97.79 |
| Copper Interconnects and Reliability | Lifetime | 257 | BE 11 | 97.22 |
| Silicon and Solar Cell Technologies | Lifetime | 482 | BE 14 | 97.40 |
| Advancements in Semiconductor Devices and Circuit Design | Lifetime | 891 | BE 44 | 97.16 |
| Acoustic Wave Resonator Technologies | Lifetime | 792 | BE 6 | 96.37 |
| Electrostatic Discharge in Electronics | Lifetime | 543 | BE 15 | 93.75 |
| Semiconductor materials and devices | 2021-2025 | 942 | BE 31 | 91.16 |
| Copper Interconnects and Reliability | 2021-2025 | 72 | BE 10 | 88.83 |
| Advancements in Semiconductor Devices and Circuit Design | 2021-2025 | 831 | BE 32 | 85.80 |
| 3D IC and TSV technologies | 2021-2025 | 767 | BE 37 | 74.04 |