Top1000 Scholar

Scholarly Index

Zhi‐Quan Liu

Shenzhen University; 8,242 total citations; 327 total publications; best world rank #12

Shenzhen University

8,242Total citations
327Total publications
37H-index

Published ranking records

FieldWindowWorld rankNational rankImpact score
Electronic Packaging and Soldering TechnologiesLifetime84CN 2098.77
3D IC and TSV technologiesLifetime89CN 2198.77
Intermetallics and Advanced Alloy PropertiesLifetime657CN 14796.70
Copper Interconnects and ReliabilityLifetime584CN 3395.11
Advanced Welding Techniques AnalysisLifetime933CN 29793.69
Electronic Packaging and Soldering Technologies2021-202527CN 1597.67
Copper Interconnects and Reliability2021-202512CN 396.32
3D IC and TSV technologies2021-202557CN 2496.00
Electrodeposition and Electroless Coatings2021-202581CN 4091.01
Intermetallics and Advanced Alloy Properties2021-2025711CN 51084.19
Nanoporous metals and alloys2021-2025184CN 10367.42
Anodic Oxide Films and Nanostructures2021-2025534CN 16552.63