Top1000 Scholar

Scholarly Index

Katsuyuki Sakuma

IBM (United States); 2,421 total citations; 99 total publications; best world rank #129

IBM (United States)

2,421Total citations
99Total publications
22H-index

Published ranking records

FieldWindowWorld rankNational rankImpact score
3D IC and TSV technologiesLifetime373US 10796.59
Electronic Packaging and Soldering TechnologiesLifetime466US 9395.94
Electrical and Thermal Properties of MaterialsLifetime533US 4680.17
3D IC and TSV technologies2021-2025129US 2193.39
Electronic Packaging and Soldering Technologies2021-2025250US 1889.13