Top1000 Scholar

Scholarly Index

Megan J. Cordill

Erich Schmid Institute of Materials Science; 4,152 total citations; 251 total publications; best world rank #133

Erich Schmid Institute of Materials Science

4,152Total citations
251Total publications
33H-index

Published ranking records

FieldWindowWorld rankNational rankImpact score
Electronic Packaging and Soldering TechnologiesLifetime265AT 297.32
Copper Interconnects and ReliabilityLifetime383AT 596.38
Metal and Thin Film Mechanics2021-2025234AT 696.25
Copper Interconnects and Reliability2021-2025133AT 282.56
Electronic Packaging and Soldering Technologies2021-2025399AT 285.09
Adhesion, Friction, and Surface Interactions2021-2025728AT 674.41
Force Microscopy Techniques and Applications2021-2025965AT 971.61