Top1000 Scholar

Scholarly Index

Jenq‐Gong Duh

National Tsing Hua University; 10,498 total citations; 467 total publications; best world rank #18

National Tsing Hua University

10,498Total citations
467Total publications
52H-index

Published ranking records

FieldWindowWorld rankNational rankImpact score
3D IC and TSV technologiesLifetime18TW 299.55
Electronic Packaging and Soldering TechnologiesLifetime20TW 299.44
Metal and Thin Film MechanicsLifetime184TW 299.34
Advanced Welding Techniques AnalysisLifetime103TW 298.75
Diamond and Carbon-based Materials ResearchLifetime285TW 698.61
Electrodeposition and Electroless CoatingsLifetime68TW 498.09
Intermetallics and Advanced Alloy PropertiesLifetime175TW 398.66
Advanced materials and compositesLifetime331TW 498.65
Copper Interconnects and ReliabilityLifetime237TW 1497.42
Advanced ceramic materials synthesisLifetime629TW 797.64
Nuclear materials and radiation effectsLifetime428TW 396.02
High-Temperature Coating BehaviorsLifetime690TW 1396.07
Boron and Carbon Nanomaterials ResearchLifetime625TW 595.40
Metallurgical and Alloy ProcessesLifetime293TW 894.95
Metallic Glasses and Amorphous AlloysLifetime642TW 795.02
Electrical and Thermal Properties of MaterialsLifetime708TW 1474.69
3D IC and TSV technologies2021-2025248TW 2688.85
Electronic Packaging and Soldering Technologies2021-2025367TW 2985.95