Scholarly Index
Chien‐Neng Liao
National Tsing Hua University; 2,499 total citations; 122 total publications; best world rank #129
National Tsing Hua University
2,499Total citations
122Total publications
27H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| Copper Interconnects and Reliability | Lifetime | 428 | TW 29 | 96.05 |
| Electronic Packaging and Soldering Technologies | Lifetime | 429 | TW 42 | 96.21 |
| Advanced Thermoelectric Materials and Devices | Lifetime | 674 | TW 9 | 94.91 |
| Thermal properties of materials | Lifetime | 825 | TW 9 | 92.82 |
| Copper Interconnects and Reliability | 2021-2025 | 129 | TW 26 | 83.09 |
| Anodic Oxide Films and Nanostructures | 2021-2025 | 411 | TW 10 | 59.74 |