Scholarly Index
Fengze Hou
Institute of Microelectronics; 926 total citations; 68 total publications; best world rank #588
Institute of Microelectronics
926Total citations
68Total publications
17H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| Electronic Packaging and Soldering Technologies | 2021-2025 | 588 | CN 268 | 79.85 |
| 3D IC and TSV technologies | 2021-2025 | 666 | CN 252 | 76.52 |