Top1000 Scholar

Scholarly Index

Fan-Yi Ouyang

National Tsing Hua University; 1,563 total citations; 71 total publications; best world rank #41

National Tsing Hua University

1,563Total citations
71Total publications
22H-index

Published ranking records

FieldWindowWorld rankNational rankImpact score
Electronic Packaging and Soldering TechnologiesLifetime321TW 3096.90
3D IC and TSV technologiesLifetime374TW 3096.55
Copper Interconnects and ReliabilityLifetime824TW 5193.95
Copper Interconnects and Reliability2021-202541TW 992.38
Electronic Packaging and Soldering Technologies2021-2025209TW 1790.77
3D IC and TSV technologies2021-2025460TW 4582.35