Scholarly Index
J.H.L. Pang
Nanyang Technological University; 7,925 total citations; 272 total publications; best world rank #24
Nanyang Technological University
7,925Total citations
272Total publications
47H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| Electronic Packaging and Soldering Technologies | Lifetime | 24 | SG 1 | 99.35 |
| 3D IC and TSV technologies | Lifetime | 34 | SG 1 | 99.37 |
| Fatigue and fracture mechanics | Lifetime | 154 | SG 1 | 98.75 |
| Advanced Welding Techniques Analysis | Lifetime | 158 | SG 1 | 98.35 |
| Mechanical stress and fatigue analysis | Lifetime | 320 | SG 2 | 96.75 |
| Integrated Circuits and Semiconductor Failure Analysis | Lifetime | 950 | SG 13 | 96.35 |
| Aluminum Alloy Microstructure Properties | Lifetime | 966 | SG 4 | 96.43 |
| Non-Destructive Testing Techniques | Lifetime | 877 | SG 4 | 94.98 |
| Optical measurement and interference techniques | Lifetime | 815 | SG 7 | 94.97 |
| Mechanical Behavior of Composites | Lifetime | 901 | SG 10 | 95.77 |
| Copper Interconnects and Reliability | Lifetime | 961 | SG 14 | 93.30 |
| Material Properties and Processing | Lifetime | 540 | SG 5 | 91.24 |
| Engineering Structural Analysis Methods | Lifetime | 644 | SG 2 | 87.31 |