Top1000 Scholar

Scholarly Index

Yang Liu

Shanghai Pudong Institute of Education Development; 3,105 total citations; 2,171 total publications; best world rank #20

Shanghai Pudong Institute of Education Development

3,105Total citations
2,171Total publications
27H-index

Published ranking records

FieldWindowWorld rankNational rankImpact score
3D IC and TSV technologiesLifetime185CN 4697.94
Electronic Packaging and Soldering TechnologiesLifetime212CN 6097.70
Electronic Packaging and Soldering Technologies2021-202520CN 1197.96
3D IC and TSV technologies2021-202524CN 1197.72
Copper Interconnects and Reliability2021-2025136CN 3082.31