Top1000 Scholar

Scholarly Index

Cheng‐Yi Liu

National Central University; 3,260 total citations; 173 total publications; best world rank #190

National Central University

3,260Total citations
173Total publications
30H-index

Published ranking records

FieldWindowWorld rankNational rankImpact score
Electronic Packaging and Soldering TechnologiesLifetime197TW 2197.79
3D IC and TSV technologiesLifetime250TW 2397.44
Copper Interconnects and ReliabilityLifetime516TW 3895.51
Copper Interconnects and Reliability2021-2025190TW 3077.69
Electronic Packaging and Soldering Technologies2021-2025692TW 6277.30
Metallurgical and Alloy Processes2021-2025360TW 645.92