Scholarly Index
M. Murugesan
Tohoku University; 1,335 total citations; 162 total publications; best world rank #174
Tohoku University
1,335Total citations
162Total publications
18H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| 3D IC and TSV technologies | Lifetime | 518 | JP 29 | 95.55 |
| Electronic Packaging and Soldering Technologies | Lifetime | 766 | JP 59 | 94.40 |
| 3D IC and TSV technologies | 2021-2025 | 174 | JP 9 | 91.92 |
| Electronic Packaging and Soldering Technologies | 2021-2025 | 201 | JP 14 | 91.04 |
| Copper Interconnects and Reliability | 2021-2025 | 194 | JP 8 | 77.53 |