Scholarly Index
Yifan Yao
Nankai University; 510 total citations; 53 total publications; best world rank #109
Nankai University
510Total citations
53Total publications
15H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| 3D IC and TSV technologies | 2021-2025 | 171 | CN 82 | 92.00 |
| Electronic Packaging and Soldering Technologies | 2021-2025 | 194 | CN 107 | 91.25 |
| Copper Interconnects and Reliability | 2021-2025 | 109 | CN 26 | 84.73 |