Scholarly Index
T. Matsuda
The University of Osaka; 4,041 total citations; 228 total publications; best world rank #139
The University of Osaka
4,041Total citations
228Total publications
32H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| Electronic Packaging and Soldering Technologies | Lifetime | 619 | JP 47 | 95.08 |
| Advanced Welding Techniques Analysis | Lifetime | 747 | JP 60 | 94.69 |
| Thermodynamic and Structural Properties of Metals and Alloys | Lifetime | 480 | JP 68 | 92.11 |
| Electronic Packaging and Soldering Technologies | 2021-2025 | 139 | JP 8 | 93.33 |
| Advanced Welding Techniques Analysis | 2021-2025 | 405 | JP 7 | 90.73 |
| Copper Interconnects and Reliability | 2021-2025 | 704 | JP 35 | 52.67 |