Scholarly Index
Hongjun Ji
Harbin Institute of Technology; 4,165 total citations; 168 total publications; best world rank #135
Harbin Institute of Technology
4,165Total citations
168Total publications
33H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| Electronic Packaging and Soldering Technologies | Lifetime | 135 | CN 37 | 98.25 |
| 3D IC and TSV technologies | Lifetime | 370 | CN 99 | 96.61 |
| Advanced Welding Techniques Analysis | Lifetime | 385 | CN 138 | 96.81 |
| Nanomaterials and Printing Technologies | Lifetime | 734 | CN 199 | 89.43 |
| Advanced Welding Techniques Analysis | 2021-2025 | 953 | CN 438 | 82.27 |
| Copper Interconnects and Reliability | 2021-2025 | 304 | CN 79 | 70.31 |
| Nanomaterials and Printing Technologies | 2021-2025 | 559 | CN 250 | 71.21 |
| Surface Treatment and Residual Stress | 2021-2025 | 542 | CN 363 | 68.09 |