Scholarly Index

Katsuaki Suganuma

The University of Osaka; 21,974 total citations; 832 total publications; best world rank #4

The University of Osaka

21,974Total citations

832Total publications

72H-index

Published ranking records

Field	Window	World rank	National rank	Impact score
3D IC and TSV technologies	Lifetime	5	JP 1	99.83
Electronic Packaging and Soldering Technologies	Lifetime	4	JP 1	99.83
Advanced Welding Techniques Analysis	Lifetime	26	JP 3	99.53
Aluminum Alloys Composites Properties	Lifetime	68	JP 10	99.67
Copper Interconnects and Reliability	Lifetime	38	JP 2	99.18
Nanomaterials and Printing Technologies	Lifetime	17	JP 2	99.29
Advanced ceramic materials synthesis	Lifetime	104	JP 9	99.32
Intermetallics and Advanced Alloy Properties	Lifetime	58	JP 9	99.34
Material Properties and Applications	Lifetime	103	JP 5	97.94
Advanced Sensor and Energy Harvesting Materials	Lifetime	272	JP 6	99.30
Aluminum Alloy Microstructure Properties	Lifetime	301	JP 16	98.58
Additive Manufacturing and 3D Printing Technologies	Lifetime	616	JP 12	97.34
Metallurgical and Alloy Processes	Lifetime	162	JP 28	96.59
Silicon Carbide Semiconductor Technologies	Lifetime	603	JP 39	97.23
Boron and Carbon Nanomaterials Research	Lifetime	664	JP 57	95.17
Electrical Contact Performance and Analysis	Lifetime	240	JP 18	92.12
Powder Metallurgy Techniques and Materials	Lifetime	589	JP 48	89.06
Electronic Packaging and Soldering Technologies	2021-2025	14	JP 3	98.44
3D IC and TSV technologies	2021-2025	45	JP 5	96.63
Aluminum Alloys Composites Properties	2021-2025	766	JP 11	93.79
Copper Interconnects and Reliability	2021-2025	59	JP 3	90.07
Nanoporous metals and alloys	2021-2025	509	JP 20	41.96
Powder Metallurgy Techniques and Materials	2021-2025	648	JP 25	33.76