Top1000 Scholar

Scholarly Index

Sheng‐Jye Hwang

National Cheng Kung University; 1,983 total citations; 126 total publications; best world rank #100

National Cheng Kung University

1,983Total citations
126Total publications
26H-index

Published ranking records

FieldWindowWorld rankNational rankImpact score
Electronic Packaging and Soldering TechnologiesLifetime477TW 4595.87
Injection Molding Process and PropertiesLifetime228TW 795.88
3D IC and TSV technologiesLifetime700TW 5194.62
Epoxy Resin Curing ProcessesLifetime961TW 3791.52
Injection Molding Process and Properties2021-2025100TW 489.55
3D IC and TSV technologies2021-2025541TW 5679.86
Electronic Packaging and Soldering Technologies2021-2025859TW 8073.40
Epoxy Resin Curing Processes2021-2025691TW 1171.98
Polymer Foaming and Composites2021-2025310TW 1069.61