Scholarly Index
Tengfei Jiang
University of Central Florida; 934 total citations; 49 total publications; best world rank #572
University of Central Florida
934Total citations
49Total publications
15H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| 3D IC and TSV technologies | Lifetime | 626 | US 155 | 95.04 |
| Electronic Packaging and Soldering Technologies | Lifetime | 970 | US 209 | 93.36 |
| 3D IC and TSV technologies | 2021-2025 | 572 | US 98 | 79.29 |
| Electronic Packaging and Soldering Technologies | 2021-2025 | 621 | US 63 | 79.07 |